Process and device for connection/disconnection of an optical fiber with an optoelectronic component

ABSTRACT

The invention relates to a device and a process for connecting at least one optical fiber (F) with an optoelectronic component. The device comprises at least one housing ( 8 ) provided with at least one mobile arm ( 9, 10 ), the housing comprising:  
     a first zone (Z 1 ) to insert the fiber into the housing without applying any pressure on the mobile arm, the first zone being delimited by a part of the wall of the housing and by the mobile arm, and  
     a second zone (Z 2 ) to fix the fiber in the housing after pressure is exerted by the fiber on the mobile arm.  
     The invention is applicable to any type of connection between an optical fiber and an optoelectronic component such as a photo-emitter, photo-detector, wave guide, etc.

DESCRIPTION

[0001] 1. Technical Field and Prior Art

[0002] This invention relates to a process and a device forconnecting/disconnecting an optical fiber with an optoelectroniccomponent.

[0003] The process according to the invention aligns at least oneoptical fiber and at least one optoelectronic component in order to makea high precision assembly. This assembly may be temporary.

[0004] The optoelectronic component may be a photo-emitter, aphoto-detector, another fiber, a wave guide network, and more generallyany optical or electrical circuit that can be connected to an opticalfiber.

[0005] Different techniques are known in prior art to align and assemblean optical fiber with an optoelectronic component. The most frequentlyused techniques are broken down into two distinct groups, namely“active” techniques and “passive” techniques.

[0006] In an “active” technique, the alignment of the optical fiber andthe optoelectronic component is done in two steps. In the first step,the optical fiber and the optoelectronic component are aligned with eachother approximately. In a second step, the optical fiber and theoptoelectronic component are powered to check that they actually work(optical and/or electrical supply). The precise alignment between thefiber and the component is then made by optimizing optical and/orelectrical measurements. Once the optimum position has been found, thefiber and the component are fixed to each other by bonding, soldering orany other known means of mechanical support. For example, it is thuspossible to align an optical fiber and a laser by measuring the lightoutput from the laser that is coupled in the fiber.

[0007] In a “passive” technique, the components to be aligned includeself-alignment means. For example, this is the case for theself-alignment method using solder beads, commonly called the“flip-chip” method.

[0008]FIG. 1 shows a principle diagram for the self-alignment deviceaccording to prior art described in the document entitled“Through-etched silicon carriers for passive alignment of optical fibersto surface-active optoelectronic components” (Sensors and Actuators 82(2000), 245-248).

[0009] The device in FIG. 1 comprises an optoelectronic component 1provided with an access port 2, an optical fiber 3 to be aligned withthe access port 2, a plate 4 through which a conical hole 5 is drilledand solder beads 6.

[0010] The alignment between the fiber 3 and the access port 2 is madeby inserting the fiber in the conical hole 5. The conical shape of thehole facilitates alignment between the fiber and the access port.

[0011] However, there are several disadvantages related to thistechnique. Firstly, it is relatively difficult to make the hole conicaland the alignment precision is not as good: the precision is lower asthe taper increases. Furthermore, there is no force to hold the fiber inplace once the fiber has been inserted in the hole. The fiber then hasto be fixed by bonding and held in place mechanically during bonding.

[0012] The invention does not have the disadvantages mentioned above.

PRESENTATION OF THE INVENTION

[0013] The invention relates to a device for connecting at least oneoptical fiber with an optoelectronic component. The device comprises atleast one housing provided with at least one mobile arm, the housingcomprising:

[0014] a first zone to insert the fiber into the housing withoutapplying any pressure on the mobile arm, the first zone being delimitedby a part of the wall of the housing and by the mobile arm, and

[0015] a second zone to fix the fiber in the housing after pressure isexerted by the fiber on the mobile arm.

[0016] The invention also relates to a process for connection of atleast one optical fiber with an optoelectronic component. The processcomprises the following steps in sequence:

[0017] the fiber is inserted in a first zone of a housing in which thereis at least one mobile arm, the fiber being inserted without applyingany pressure on the mobile arm(s),

[0018] the fiber is moved towards one end of the mobile arm(s),

[0019] the optical fiber applies pressure to the end of the mobilearm(s) such that the mobile arm(s) (is) are eventually fixed in a fiberretention position in a second zone (Z2) of the housing.

[0020] The invention also relates to an attachment structure for aconnector fitted with optical fibers to an optoelectronic component, theconnector comprising at least one guide pin. The structure comprises atleast one housing provided with at least one mobile arm, the housingcomprising:

[0021] a first zone to insert the guide pin into the housing withoutapplying any pressure on the mobile arm, the first zone being delimitedby a part of the wall of the housing and by the mobile arm, and

[0022] a second zone to fix the guide pin in the housing after pressureis applied by the guide pin on the mobile arm.

[0023] The invention also relates to a process for attachment of aconnector equipped with optical fibers to a microelectronic component,the connector comprising at least one guide pin. The process comprisesthe following steps in sequence:

[0024] the guide pin is inserted in a first zone of a housing providedwith at least one mobile arm, the guide pin being inserted withoutapplying any pressure on the mobile arm(s),

[0025] the guide pin is moved towards one end of the mobile arm(s),

[0026] the guide pin applies pressure to the end of the mobile arm(s)such that the mobile arm(s) (is) are eventually fixed in a guide pinretention position in a second zone (Z2) of the housing.

BRIEF DESCRIPTION OF THE FIGURES

[0027] Other characteristics and advantages of the invention will becomeclear after reading the preferred embodiments of the invention withreference to the attached figures including:

[0028]FIG. 1 shows an optical fiber connection device with anoptoelectronic component according to prior art,

[0029]FIGS. 2A and 2B show a top view and a sectional view respectivelyof a device for connection of an optical fiber with an optoelectroniccomponent according to a first embodiment of the invention,

[0030]FIGS. 3A and 3B show a top view and a sectional view respectivelyof a device for connection of an optical fiber ribbon with anoptoelectronic device,

[0031]FIGS. 4A and 4B show a top view and a sectional view respectivelyof a structure for a connection between an optical connector fitted withguide pins and an optoelectronic device,

[0032]FIG. 5 shows a device for connection of an optical fiber with anoptoelectronic component according to a second embodiment of theinvention,

[0033]FIG. 6 shows a device for connection of an optical fiber with anoptical component according to a third embodiment of the invention,

[0034]FIG. 7 shows a device for connection of an optical fiber with anoptoelectronic component according to a fourth embodiment of theinvention.

[0035] The same marks denotes the same elements on all figures.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION

[0036]FIG. 2A shows a top view of a device for connection of an opticalfiber with an optoelectronic component according to a first embodimentof the invention. FIG. 2B shows a view along section A-A in FIG. 2A.

[0037] The connection device is composed of a mechanical part 7, forexample made of silicon, in which a housing 8 is formed. The housing 8comprises two mobile arms 9 and 10, for example micro mechanical springarms made of silicon. The mobile arms 9 and 10 define two zones Z1, Z2in the housing 8. A first zone Z1 is delimited by part of the wall ofthe housing 8 and by mobile arms 9 and 10 on which no pressure isexerted. Zone Z1 is the zone in which the fiber is inserted in thehousing 8. A second zone Z2 is defined as being the zone of the housing8 in which the fiber is immobilized in a retention position after thefiber has applied pressure onto the ends of the mobile arms. When nopressure is applied to the mobile arms 9 and 10, the distance L thatseparates their ends is less than diameter D of the fiber.

[0038] The process for attachment of a fiber in the connection devicecomprises the following steps:

[0039] the fiber is inserted in the first zone Z1 if no pressure isexerted on the mobile arm (position a in FIG. 2A),

[0040] the optical fiber moves towards the end of the mobile arms 9 and10 so that the fiber comes into contact with these ends (position b onFIG. 2A),

[0041] the fiber applies pressure on the ends of the arms 9 and 10 so asto move the arms away from each other (position C on FIG. 2A),

[0042] the pressure exerted by the fiber on the ends of the arms 9 and10 continues such that the mobile arms are eventually fixed in place ina fiber retention position.

[0043] As a non-restrictive example, the first zone Z1 into which thefiber F is inserted is at least a zone in which the diameter of thecontour C1 is 140 μm for an optical fiber with a diameter of 125 μm.

[0044] It is obvious that the fiber can be removed by making a movementopposite to the movement described above, and then reinserted once againas many times as necessary. If there is no need to remove the fiberafter it has been inserted, the assembly can be solidified, for exampleusing an epoxy glue cross-linked by UV.

[0045]FIG. 3A shows a top view of a device for connection of an opticalfiber ribbon with an optoelectronic device. FIG. 3B shows a view alongsection B-B in FIG. 3A.

[0046] Four optical fibers F1, F2, F3, F4 installed on a ribbon 11 areconnected to the corresponding access ports A1, A2, A3, A4 in anoptoelectronic device 13. A connection device 12 comprises fourelementary connection devices like that shown on FIGS. 2A and 2B. Eachelementary connection device can be used to align an optical fiber withan access port (see FIG. 3B). Solder beads 14 fix the connection device12 to the optoelectronic device 13.

[0047] Preferably, the connection device 12 is composed of a siliconboard and the housings 8 are made collectively by etching in the siliconplate (plasma, chemical, etc.).

[0048]FIG. 4A shows a top view of a structure for the attachment of aconnector fitted with optical fibers to an optoelectronic component.FIG. 4B shows a view along section C-C in FIG. 4A.

[0049] A connector 15 equipped with optical fibers F1, F2, F3, F4, F5,for example an MT (Mechanically Transferable) connector is inserted in asilicon plate 19 using guide pins 16, 17. Each guide pin 16, 17 is fixedto the silicon plate by a connection device according to the invention.An optoelectronic component 18 provided with access ports A1, A2, A3,A4, A5 is fixed on one face of the silicon plate 19 by solder beads 20.The optoelectronic component 18 is placed between the guides pin 16 and17 such that the optical fibers F1, F2, F3, F4, F5 are aligned with thecorresponding ports A1, A2, A3, A4, A5. Due to the precision of theconnection according to the invention, the optical fibers F1, F2, F3,F4, F5 are aligned almost perfectly with the corresponding access portsA1, A2, A3, A4, A5.

[0050]FIG. 5 shows a device for connection of an optical fiber with anoptical electronic component according to a second embodiment of theinvention.

[0051] The connection device according to the second embodiment of theinvention comprises two mobile arms 21 and 22 positioned symmetricallywith respect to an axis XX′. The attachment position of the opticalfiber is then such that the fiber is held in place between the mobilearms 21 and 22.

[0052]FIG. 6 shows an optical fiber connection device with anoptoelectronic component according to a third embodiment of theinvention.

[0053] In this case, the device according to the invention comprises asingle mobile arm 23. In this case the zone in which the fiber is heldin the housing (Z2) is delimited by one end of the mobile arm 23 and bya part of the wall of the housing.

[0054]FIG. 7 shows a device for the connection of an optical fiber withan optoelectronic component according to a fourth embodiment of theinvention.

[0055] In this case fiber F is held in place by three mobile arms 24, 25and 26. The first zone Z1 is delimited by part of the wall of thehousing and by two of the mobile arms 24 and 25. The second zone Z2 isdelimited by the ends of the two mobile arms 24 and 25 on which thefiber is applied by pressure and by the body of the third mobile arm 26on which the fiber applies pressure. This embodiment advantageouslykeeps the fiber F simply supported. Another advantage is that the fiberalignment does not depend on variations in the silicon etchingdimensions.

[0056] Advantageously, all optical couplings may be made usingconnection devices according to the invention; Fiber/VCSEL (VerticalCavity Surface Emitting Laser) coupling, fiber/fiber coupling,fiber/detector coupling, fiber/wave guide coupling. All electro-optictests may also be made easily, before the components are fixedpermanently. Optical fiber inputs are then used to simulate the finalassembly.

1. Device for connecting at least one optical fiber (F) with anoptoelectronic component (12), characterized in that it comprises atleast one housing (8) provided with at least one mobile arm (9, 10), thehousing comprising: a first zone (Z1) to insert the fiber into thehousing without applying any pressure on the mobile arm, the first zonebeing delimited by a part of the wall of the housing and by the mobilearm, and a second zone (Z2) to fix the fiber in the housing afterpressure is exerted by the fiber on the mobile arm.
 2. Connection deviceaccording to claim 1, characterized in that the housing contains asingle mobile arm (23) and in that the second zone (Z2) is delimited byone end of the mobile arm (23) and by a part of the wall of the housing.3. Connection device according to claim 1, characterized in that thehousing comprises two mobile arms (9, 10) and in that the second zone(Z2) is delimited by the ends of the two mobile arms (9, 10) and part ofthe wall of the housing.
 4. Connection device according to claim 1,characterized in that the housing comprises two mobile arms (21, 22) andin that the second zone (Z2) is delimited by the body of the two mobilearms in which the fiber is inserted and part of the wall of the housing.5. Connection device according to claim 1, characterized in that thehousing contains three mobile arms (24, 25, 26) and in that the firstzone (Z1) is delimited by a part of the wall of the housing and by twoof the mobile arms (24, 25) and in that the second zone (Z2) isdelimited by the ends of two of the said mobile arms (24, 25) and by thebody of a third mobile arm (26) on which the optical fiber appliespressure.
 6. Device according to any one of the previous claims,characterized in that it is made of silicon and in that the mobilearm(s) is (are) of the micro mechanical spring type made of silicon. 7.Process for connection of at least one optical fiber (F) with anoptoelectronic component (12), characterized in that it comprises thefollowing steps in sequence: the fiber is inserted in a first zone (Z1)of the housing (8) in which there is at least one mobile arm (9, 10),the fiber being inserted without applying any pressure on the mobilearm(s), the fiber is moved towards one end of the mobile arm(s), theoptical fiber applies pressure to the end of the mobile arm(s) such thatthe mobile arm(s) is (are) eventually fixed in a fiber retentionposition in a second zone (Z2) of the housing.
 8. Connection processaccording to claim 7, characterized in that it comprises an additionalstep to fix the fiber inside the second zone (Z2) of the housing usingglue.
 9. Attachment structure (19) for a connector fitted with opticalfibers (F1, F2, F3, F4, F5) to an optoelectronic component (18), theconnector comprising at least one guide pin (16, 17), characterized inthat the structure comprises at least one housing provided with at leastone mobile arm, the housing comprising: a first zone (Z1) to insert theguide pin (16, 17) into the housing (8) without applying any pressure onthe mobile arm, the first zone being delimited by a part of the wall ofthe housing and by the mobile arm, and a second zone (Z2) to fix theguide pin in the housing after pressure is applied by the guide pin onthe mobile arm.
 10. Attachment structure according to claim 9,characterized in that the housing contains a single mobile arm (23) andin that the second zone (Z2) is delimited by the end of the mobile armand by a part of the wall of the housing.
 11. Attachment structureaccording to claim 9, characterized in that the housing contains twomobile arms (9, 10) and in that the second zone (Z2) is delimited by theends of the two mobile arms and a part of the wall of the housing. 12.Attachment structure according to claim 9, characterized in that thehousing contains two mobile arms (21, 22) and in that the second zone(Z2) is delimited by the body of the mobile arms in which the guide pinis inserted and a part of the wall of the housing.
 13. Attachmentstructure according to claim 9, characterized in that the housingcontains three mobile arms (24, 25, 26) and in that the first zone (Z1)is delimited by a part of the wall of the housing and by two mobile arms(24, 25) among the three mobile arms and in that the second zone (Z2) isdelimited by the said ends of the two mobile arms (24, 25) and by thebody of the third mobile arm (26) on which the guide pin bears. 14.Structure according to any one of claims 9 to 12, characterized in thatit is made with silicon and in that the mobile arms are of the micromechanical spring type made with silicon.
 15. Process for attachment ofa connector equipped with optical fibers to an optoelectronic component,the connector comprising at least one guide pin (16, 17), characterizedin that it comprises the following steps in sequence: the guide pin isinserted in a first zone (Z1) of a housing (8) provided with at leastone mobile arm (9, 10), the guide pin being inserted without applyingany pressure on the mobile arm(s), the guide pin is moved towards oneend of the mobile arm(s), the guide pin applies pressure to the end ofthe mobile arm(s) such that the mobile arm(s) is (are) eventually fixedin a guide pin retaining position in a second zone (Z2) of the housing.